Effect of Surface Microstructure on the Heat Dissipation Performance of Heat Sinks Used in Electronic Devices

Yuxin You#, Beibei Zhang#, Sulian Tao*, Zihui Liang, Biao Tang, Rui Zhou, Dong Yuan*

Effect of Surface Microstructure on the Heat Dissipation Performance of Heat Sinks Used in Electronic Devices

ABSTRACT

Heat sinks are widely used in electronic devices with high heat flux. The design and build of microstructures on heat sinks has shown effectiveness in improving heat dissipation efficiency. In this paper, four kinds of treatment methods were used to make different microstructures on heat sink surfaces, and thermal radiation coating also applied onto the heat sink surfaces to improve thermal radiation. The surface roughness, thermal emissivity and heat dissipation performance with and without thermal radiation coating of the heat sinks were studied. The result shows that with an increase of surface roughness, the thermal emissivity can increase up to 2.5 times. With thermal radiation coating on a surface with microstructures, the heat dissipation was further improved because the heat conduction at the coating and heat sink interface was enhanced. Therefore, surface treatment can improve the heat dissipation performance of the heat sink significantly by enhancing the thermal convection, radiation and conduction.


Language English
Journal

MDPI-Micromachines

Year
2021
Pages 12
Volume 12
Issue number
3
Status

Published


KEYWORDS

heat sinkssurface microstructuresheat dissipation performancethermal radiationsurface roughness


DOI: https://doi.org/10.3390/mi12030265


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You Y, Zhang B, Tao S, et al. Effect of Surface Microstructure on the Heat Dissipation Performance of Heat Sinks Used in Electronic Devices[J]. Micromachines, 2021, 12(3): 265.


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